New SMT Equipment: flipchip (Page 1 of 5)

3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160

3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160

New Equipment | Inspection

3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160 Equipment overview The 3D X-ray inspection system ML-MirXT-160 is specially tailored for wafer technology, SMT, packaging inspection, semiconductor and laborator

Qinyi Electronics Co.,Ltd

Semiconductor SMT Offline X-ray X-8000

Semiconductor SMT Offline X-ray X-8000

New Equipment | Test Equipment

Semiconductor  SMT Offline X-ray X-8000 Products Introduction | I.C.T Group www.smt11.com www.smtfactory.com Full SMT Factory Solution Partner Semiconductor SMT Offline X-ray X-8000 Introduce: X-8000 electronic semiconductor testing equipment can

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Automatic Glue Dispensing Machine for PCB

Automatic Glue Dispensing Machine for PCB

New Equipment | Depaneling

I.C.T High Precision SMT PCB Dispensing Machine ❙ Introdution : Introduction:  As functionality and performance increase in the electronics field, there is an increasing need for finer and more precise coatings. The HD series machine is a micro-

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Xray Inspection

Xray Inspection

New Equipment |  

Turn-key xray systems for BGA, FlipChip and solder analysis

Manufacturing Equipment Technology, Inc.

SJB Capillary

SJB Capillary

New Equipment | Other

For Solder Jet Bonding – SJB / Flip-Chip

K-Net International Ltd.,Part

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Other

Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo

Flasonsmt Co.,ltd

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Inspection

Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo

Flasonsmt Co.,ltd

MT Inspection System

MT Inspection System

New Equipment |  

New Generation of Video Microscope for High Quality and Reliable Visual Inspection of solder joints of BGA, uBGA, CSP and Flip-Chip packages. Connecting it to your PC or Laptop to utilize benefits of Digital Image Capture, Measurements and Data Manag

Mossman Technologies Pte Ltd

SIPLACE CA Series - Chip Assembly and SMT Placement on a single platform

SIPLACE CA Series - Chip Assembly and SMT Placement on a single platform

New Equipment | Pick & Place

Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production

ASM Assembly Systems GmbH & Co. KG

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Pick & Place

http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des

Flason Electronic Co.,limited

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