New SMT Equipment: flipchip bonder (Page 1 of 1)

High Force ACF Bonder

High Force ACF Bonder

New Equipment | IC Packaging

Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha

Finetech

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

New Equipment | Rework & Repair Equipment

Future in Advanced Rework. The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy. With a high level of process modularity, the system supports

Finetech

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flipchip bonder searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

Training online, at your facility, or at one of our worldwide training centers"
Void Free Reflow Soldering

High Throughput Reflow Oven
pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
2024 Eptac IPC Certification Training Schedule

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Fully Automatic BGA Rework Station

Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India