Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the
Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe
This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control
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