New SMT Equipment: flux activating temperature (Page 1 of 26)

ETA S-Series High-End Reflow Ovens

ETA S-Series High-End Reflow Ovens

New Equipment | Reflow

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

ETA E-Series Lead-Free Reflow Ovens

ETA E-Series Lead-Free Reflow Ovens

New Equipment | Reflow

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Heller 2043 MK7 SMT Reflow Oven

Heller 2043 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,

Qersa Technology Co.,ltd

ETA A-Series Energy Saving Reflow Ovens

ETA A-Series Energy Saving Reflow Ovens

New Equipment | Reflow

A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co

I.C.T ( Dongguan ICT Technology Co., Ltd. )

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

Heller 1809 MK7 SMT Reflow Oven

Heller 1809 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1809 MK7 SMT Reflow Oven Heating Zones: Top 8 / Bottom 8PCB Width:50 - 560 mmlength: 465cmProduct description: Heller 1809 MK7 SMT Reflow Oven, Heating Zones: Top 8 / Bottom 8, PCB Width:50 - 560 mm, length: 465cm   Heller 1809 MK7 SMT Ref

Qersa Technology Co.,ltd

Heller 2049 MK7 SMT Reflow Oven

Heller 2049 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2049 MK7 SMT Reflow Oven Heating Zones: Top 15/ Bottom 15PCB Width:50 - 560 mmProduct description: Heller 2049 MK7 SMT Reflow Oven, Heating Zones: Top 15/ Bottom 15, PCB Width:50 - 560 mm   Heller 2049 MK7 SMT Reflow Oven Heller 2049 MK7

Qersa Technology Co.,ltd

Heller 2156 MK7 SMT Reflow Oven

Heller 2156 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2156 MK7 SMT Reflow Oven Heating Zones: Top 17/ Bottom 17PCB Width:50 - 560 mmLength: 869cmProduct description: Heller 2156 MK7 SMT Reflow Oven, Heating Zones: Top 17/ Bottom 17, PCB Width:50 - 560 mm, Length: 869cm   Heller 2156 MK7 SMT R

Qersa Technology Co.,ltd

Heller 1826 MK7 SMT Reflow Oven

Heller 1826 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1826 MK7 SMT Reflow Oven Heating Zones:Top 8 / Bottom 8PCB Width:50 - 560 mmWeight: 1970 kgDimension: W4650 x D1520 x H1440 mmProduct description: Heller 1826 MK7 SMT Reflow Oven, Heating Zones:Top 8 / Bottom 8, PCB Width:50 - 560 mm, Weight:

Qersa Technology Co.,ltd

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flux activating temperature searches for Companies, Equipment, Machines, Suppliers & Information

convection smt reflow ovens

World's Best Reflow Oven Customizable for Unique Applications
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
PCB Handling with CE

High Throughput Reflow Oven
Fluid Dispensing, Staking, TIM, Solder Paste

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.


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