New SMT Equipment: flux activation pre heat temperature (Page 1 of 4)

ETA S-Series High-End Reflow Ovens

ETA S-Series High-End Reflow Ovens

New Equipment | Reflow

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

ETA E-Series Lead-Free Reflow Ovens

ETA E-Series Lead-Free Reflow Ovens

New Equipment | Reflow

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

HotDots™ for Holding Jumper Wires in Place

HotDots™ for Holding Jumper Wires in Place

New Equipment | Rework & Repair Equipment

BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a

BEST Inc.

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

Durostone® PCB Solder Pallet Materials

Durostone® PCB Solder Pallet Materials

New Equipment | Materials

High performance composite materials specifically designed for the PCB assembly process Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT r

Röchling Engineering Plastics

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

PACE IR 3000 Infrared BGA/SMT Rework System

PACE IR 3000 Infrared BGA/SMT Rework System

New Equipment | Rework & Repair Equipment

Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in

PACE Worldwide

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