New SMT Equipment: flux activity (Page 1 of 4)

ETA S-Series High-End Reflow Ovens

ETA S-Series High-End Reflow Ovens

New Equipment | Reflow

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

ETA E-Series Lead-Free Reflow Ovens

ETA E-Series Lead-Free Reflow Ovens

New Equipment | Reflow

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

E-Qual 392 No Clean Soldering Flux

E-Qual 392 No Clean Soldering Flux

New Equipment | Solder Materials

Fluxes for use with Tin/Lead Solder. EQ-392 No-Clean is a homogeneous mixture of halogenfree, low solids organic flux designed for wave-soldering conventional and surface mount PCB assemblies. EQ-392 provides superior foaming characteristics with a

DKL Metals Ltd

Kapp Comet Flux - Low Temperature Soldering Flux

Kapp Comet Flux - Low Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Comet Flux™ has been designed specifically for soldering all common metals except Aluminum. Kapp Comet Flux™ is an activated liquid flux, a mixture of inorganic salts in water, with approximately 35-40% active ingredients. Highly recommended f

Kapp Alloy & Wire, Inc

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

New Equipment | Solder Materials

Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux

Solder Direct

Paste Flux Tacky Flux

Paste Flux Tacky Flux

New Equipment | Solder Materials

Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types

solderstoreonline.com

Kapp Copper-Bond Flux - High Temperature Soldering Flux

Kapp Copper-Bond Flux - High Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien

Kapp Alloy & Wire, Inc

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

New Equipment | Solder Materials

Kapp Lunar Flux™ is a white paste for the high temperature soldering of Aluminum and Zinc die cast alloy. It is a reaction-type flux with 70% active ingredients dispersed in alcohol. Kapp Lunar Flux™ has considerable shelf life stability, as the susp

Kapp Alloy & Wire, Inc

Soldering Assembly Services

Soldering Assembly Services

New Equipment | Assembly Services

S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar

S-Bond Technologies

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