New Equipment | Rework & Repair Equipment
The PDR E3G Evolution - Next Generation Rework System - is made of only the finest materials and components for optimum precision and rework excellence. Combining PDR's ThermoActive software technology with PDR's patented Focused - Visible IR Techno
New Equipment | Rework & Repair Equipment
PDR E3M Rework System for Micro SMD Rework is made of only the finest materials and components for Micro- BGA Rework, 0201 Rework, CSP Rework, uBGA Rework, LED Rework, area Array Rework, and similar micro applications. Combining PDR's ThermoActive s
New Equipment | Rework & Repair Equipment
Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
New Equipment | Rework & Repair Equipment
Professional SMD Rework Station for PCBs upto 12"/300mm. The PDR IR-D3Vi Discovery provides all the essential features for quality rework and is made of only the finest materials and components for optimum precision and rework excellence. The PDR IR
New Equipment | Assembly Services
PentaLogix offers three levels of PCB assembly services: Kitted You provide all the parts, including the bare printed circuit boards and electronic components, and we assemble your boards using our state-of-the-art automated equipment. Partially
New Equipment | Selective Soldering
The FlexSolder S3532 is the new High Speed Stamp Soldering machine. Although new, it is built on years of experience of soldering expertise using the proven Volumetric Stamp Soldering method. If you want to solder like Bosch and other world-wide lead
New Equipment | Rework & Repair Equipment
With the Ersa HR 600 XL it is possible to professionally rework BTC components on big board assemblies. Boasting a heated area of 24 x 24 inch and a PCB thickness of up to 10 mm opens up rework capabilities in the segments of telecommunication, netwo
New Equipment | Selective Soldering
Selective Soldering System-H Specifications: MODEL HPS 4/46 HPS 4/35S Equipment parameters Dimension（L×W×H) 2450x1845x1565 (mm) 2450 x 2055 x 1665 (mm)
SUPERIOR VISION & X-RAY 2000 Advanced Inspection of Your Printed Wiring Assemblies (PWA) Including Ball Grid Array (BGA) and Other Hidden Features Photon Dynamics Superior Vision & X-ray (SVX) 2000 completely inspects PWAs inside and out. Using adv
New Equipment | Solder Materials
YINCAE is excited to announce that we have successfully developed a new No Clean Flux product - NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping a
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