New SMT Equipment: flux profile (Page 1 of 6)

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

Heller 2049 MK7 SMT Reflow Oven

Heller 2049 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2049 MK7 SMT Reflow Oven Heating Zones: Top 15/ Bottom 15PCB Width:50 - 560 mmProduct description: Heller 2049 MK7 SMT Reflow Oven, Heating Zones: Top 15/ Bottom 15, PCB Width:50 - 560 mm   Heller 2049 MK7 SMT Reflow Oven Heller 2049 MK7

Qersa Technology Co.,ltd

Heller 2156 MK7 SMT Reflow Oven

Heller 2156 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2156 MK7 SMT Reflow Oven Heating Zones: Top 17/ Bottom 17PCB Width:50 - 560 mmLength: 869cmProduct description: Heller 2156 MK7 SMT Reflow Oven, Heating Zones: Top 17/ Bottom 17, PCB Width:50 - 560 mm, Length: 869cm   Heller 2156 MK7 SMT R

Qersa Technology Co.,ltd

ETA S-Series High-End Reflow Ovens

ETA S-Series High-End Reflow Ovens

New Equipment | Reflow

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Heller 1826 MK7 SMT Reflow Oven

Heller 1826 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1826 MK7 SMT Reflow Oven Heating Zones:Top 8 / Bottom 8PCB Width:50 - 560 mmWeight: 1970 kgDimension: W4650 x D1520 x H1440 mmProduct description: Heller 1826 MK7 SMT Reflow Oven, Heating Zones:Top 8 / Bottom 8, PCB Width:50 - 560 mm, Weight:

Qersa Technology Co.,ltd

ETA E-Series Lead-Free Reflow Ovens

ETA E-Series Lead-Free Reflow Ovens

New Equipment | Reflow

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

LED Reflow Oven for 3W High Power LED

LED Reflow Oven for 3W High Power LED

New Equipment | Reflow

LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &

I.C.T ( Dongguan ICT Technology Co., Ltd. )

NC217 Lead-Free & Tin-Lead Gel Flux

NC217 Lead-Free & Tin-Lead Gel Flux

New Equipment | Solder Materials

NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source.  NC217 Gel Flux is electrically safe even without a thermal profile. This gel flux dries within one hour of use with or without heat and is t

AIM Solder

TAP Series Lead-Free Air Reflow Ovens

TAP Series Lead-Free Air Reflow Ovens

New Equipment | Reflow

Adjustable air blow speed Heater Temp ≅ Blow Air Temp Profile Temp ≅ Setting Temp Best At performance in its class Lowest run cost in its class Windows XP software operation Lead-free reflow HAT profile optimization High v

Tamura H.A. Machinery, Inc.

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