New Equipment | Cleaning Agents
AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The re
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems. It is recommended for wave solder process and ros
New Equipment | Solder Materials
Kapp Comet Flux™ has been designed specifically for soldering all common metals except Aluminum. Kapp Comet Flux™ is an activated liquid flux, a mixture of inorganic salts in water, with approximately 35-40% active ingredients. Highly recommended f
New Equipment | Cleaning Agents
CYBERSOLV 141-R dissolves rosin and low residue flux residues and then readily evaporates after the cleaning application. CYBERSOLV 141-R is designed for bench-top cleaning needs and is ideally suited for cleaning through-hole and SMT electronic asse
New Equipment | Cleaning Agents
CYBERSOLV© C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lead free flux
New Equipment | Cleaning Agents
440-R® SMT Detergent is the only stencil-cleaning chemistry verified by the U.S. EPA for specific parameters of environmental safety, user safety and cleaning efficiency and is the only stencil-cleaning chemistry to "survive the test of time". 440-R
New Equipment | Cleaning Agents
AQUANOX A4382 is a near-neutral range pH chemistry designed with superior cleaning efficacy with great material compatibility on surface mount assemblies. A4382 most effectively cleans organic acid flux residues at lower concentrations. AQUANOX A4382
New Equipment | Cleaning Agents
AQUANOX A4651US is a low pH cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. A4651US reduces the cavitation threshold, will completely remove flux residues from printed circuit assemblies and is compatible with
New Equipment | Solder Materials
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t
New Equipment | Cleaning Agents
KYZEN E5611 is a concentrated aqueous cleaning chemistry designed to remove non-reflowed solder paste and uncured chip bonder adhesives from stencils and hardware following the printing process. E5611 works on a wide range of solder paste technologie
