New Equipment | Cleaning Agents
KYZEN E5322 is engineered to effectively and efficiently perform off-line maintenance cleaning of your wave solder, reflow oven systems, and associated tooling. E5322 removes even the most difficult fluxes and solder pastes in commonly used immersion
New Equipment | Cleaning Agents
KYZEN E5314 is a versatile aqueous cleaning product specifically designed to remove non-reflowed solder paste from stencils and solder paste printing hardware. E5314 cleans flux from wave soldering pallets and light oils from assembly equipment and f
New Equipment | Cleaning Equipment
Introduction The equipment is suitable for all kinds of the outer surface of the workpiece cleaning, such as wave soldering jig, reflow soldering tray, condenser cleaning, printing scraper, machine parts surface flux, clean oil, dust etc. Integrated
New Equipment | Cleaning Agents
AQUANOX A4625B was developed specifically to remove all types of solder pastes and flux residues from printed circuit board assemblies, including the latest lead-free solder paste formulas. Originally designed to address the challenges of batch clean
New Equipment | Cleaning Agents
AQUANOX A4639 is an aqueous cleaning solution designed for hard to clean lead-free, rosin and no-clean flux residues in batch cleaning systems. A4639 provides exceptional cleaning results and protection of metallic surfaces with minimal monitoring an
New Equipment | Cleaning Agents
IONOX FCR is a high-strength, concentrated cleaner containing a blend of organic solvents and inhibitors. FCR is engineered to remove organic acid, rosin and no-clean flux residues from electronic assemblies, advanced packages, hybrid and SMT substra
New Equipment | Cleaning Agents
CYBERSOLV 141-R is a non-flammable, solvent-based cleaning fluid designed for bench-top cleaning needs removing rosin, resin and synthetic polymeric flux residues from electronic circuitry. CYBERSOLV 141-R is ideally suited for cleaning through-hole
New Equipment | Cleaning Agents
KYZEN E5325 is used in spray-in-air applications to effectively and efficiently perform off-line maintenance cleaning to remove even the most difficult fluxes and solder pastes from pallets, wave solder fingers, reflow oven parts and associated tooli
New Equipment | Cleaning Agents
MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues from wafer bumps found in die-attach, flip chip, copper pillar, and emerging semiconductor assemblies. MX2302 is used as received in all
New Equipment | Cleaning Agents
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its
