New Equipment | Soldering - Other
High specification, bench top rotary table soldering machine A versatile four station rotary bench top soldering machine, ideally suited for high or low volume production, the Quadron combines well proven pumped soldering techniques with advanced PL
New Equipment | Soldering - Other
High specification, bench top rotary table soldering machine A versatile four station rotary bench top soldering machine, ideally suited for high or low volume production, the Quadron combines well proven pumped soldering techniques with advanced PL
SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
New Equipment | Cable & Wire Harness Equipment
Flux is a manufacturer of electrical cable assemblies and wiring harnesses. Connect with Flux the next time you need a total cable package solution and let us select the connectors for you.
New Equipment | Solder Materials
Alpha has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies. The range includes no-clean, water-soluble and activated rosin fluxes in a variety of solder alloys. A
Manual press fit machine Press-fit technology Press-fit technology is that inserting flexible or rigid pins of connectors into plated through holes (PTHs) of printed circuit board (PCB) without soldering. It is reliable and easy to operate. The ba
Press-fit technology Press-fit technology is that inserting flexible or rigid pins of connectors into plated through holes (PTHs) of printed circuit board (PCB) without soldering. It is reliable and easy to operate. The basic requirement is that th
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
Methods in accordance with PRO-STD-001, SAE AS 5553, and SAE AS 6081. Process follows ISO/DIS 12931. Datest tools and training are used to detect packaging damage; ESD compliance violations; falsified or altered documentation; tampered part markin
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
