SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
New Equipment | Cleaning Equipment
The Low Cost / High Efficiency Stencil Cleaner Stainless Steel Construction Cleans Stencils up to 29" x 29" Low profile allows easy loading and unloading Side mounted “sweep frequency” ultrasonic transducers with 10 year limited warr
Press-fit technology Press-fit technology is that inserting flexible or rigid pins of connectors into plated through holes (PTHs) of printed circuit board (PCB) without soldering. It is reliable and easy to operate. The basic requirement is that th
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
New Equipment | Solder Materials
The MULTICORE portfolio of cored solder wire features the award-winning multiple flux core technology that ensures the even and consistent distribution of flux throughout the solder wire. This mainstay in Henkel’s line of solder products delivers eas
New Equipment | Solder Materials
FCT Assembly Fluxes are designed to be used with both SN100c and SAC305 alloys. By combining our latest flux tecnologies with SN100c, FCT Assembly has an advantage over all other suppliers in paste, wire and flux. FCT Assembly Flux Comparisons:
New Equipment | Cleaning Equipment
PCB Stencil & Misprint Cleaning Systems Austin American Technology's X-Series™ Vertical Format Batch Cleaning Systems provide maximum chemistry flexibility to meet a wide variety of applications. Aqueous, saponification, semi-aqueous, alcohols and
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
New Equipment | Cleaning Agents
IONOX FCR is a high-strength, concentrated cleaner containing a blend of organic solvents and inhibitors. FCR is engineered to remove organic acid, rosin and no-clean flux residues from electronic assemblies, advanced packages, hybrid and SMT substra
New Equipment | Solder Materials
IPA-based flux for foaming or spraying applications. Rosin/Resin Free Low Post-Process Residues Broad process window Fast wetting for SN100C & SAC alloys Lead-free & tin-lead compatible Halide-free Available in Industry Standard Sizes
