SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are t
New Equipment | Cleaning Agents
AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The re
SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
New Equipment | Cleaning Equipment
Rapidly and effectively removes solder pastes, adhesives and flux residues. Completely air driven Misprint Cleaning System. Very simple and fast installation and operation. Board sizes up to 455 x 305mm - single vertical. Solder paste and flux re
New Equipment | Solder Materials
Soldering materials: Soldering wires Soldering pastes Stencils Soldering shots Soldering balls Fluxes Rosin liquid and gel fluxes Fluxes residues do not cause corrosion http://www.selen.hr/pokaz_kategorie.php?cid=9
New Equipment | Solder Materials
RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based
New Equipment | Solder Materials
Kapp Lunar Flux™ is a slurry designed specifically for soldering casted Aluminum, Diecast, Zamak, White Metal and Pot Metal using Alumite™ solder. Residue is electrically conductive and slightly corrosive. Any flux residue should be removed with warm
New Equipment | Solder Materials
RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based
New Equipment | Wave Soldering
Stand-alone - matches well with any existing wave solder Minimum flux residue by: Minimal spray pressure Optimum distance from nozzle to PCB Edge-off (Pat. pending) feature Ease of Operation - Touch panel D
