S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
Simple drop-jet fluid deposition system The Pillarhouse Drop-Jet head can be used to spray fluids at any angle in either upward or downward directions. With its patented easy bleed and cleaning feature it is ideal for automation use. The head comes
E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
An offline process programming system Allows easy creation of flux, pre-heat and solder joints and baths Produces graphical representations of the PCB Solder nozzles shown as actual size Uses industry standard Gerber Data 90% of the programmin
The OmniMax reflow soldering system is designed to deliver maximum thermal performance combined with process capability and control. IsoThermal™ Chamber Technology The OmniMax reflow soldering system is designed to deliver maximum thermal per
Best-in-class thermal performance and improved sustainability, meeting the most critical and demanding reflow requirements in the industry. The Centurion™ reflow soldering oven is a forced-convection SMT reflow system with tight, closed-l
New Equipment | Selective Soldering
High speed, in-line, multi-platform selective soldering system Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offering
New Equipment | Selective Soldering
High speed, in-line, multi-platform selective soldering system Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offering
The OmniES™ is proven to exceed lead-free profile requirements and delivers efficient high performance thermal processing. IsoThermal™ Chamber Technology The OmniES offers a combination of innovation and industry-proven technologies in
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