New SMT Equipment: flux transfer (Page 2 of 3)

Indium8.9 Pb-Free Solder Paste

Indium8.9 Pb-Free Solder Paste

New Equipment | Solder Materials

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t

Indium Corporation

Pyramax - Convection Reflow Oven

Pyramax - Convection Reflow Oven

New Equipment | Reflow

  BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi

BTU International

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

SEHO GoReflow - Compact Reflow Oven

SEHO GoReflow - Compact Reflow Oven

New Equipment | Reflow

Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow

SEHO Systems GmbH

X-Series PCB Stencil Cleaners

X-Series PCB Stencil Cleaners

New Equipment | Cleaning Equipment

PCB Stencil & Misprint Cleaning Systems Austin American Technology's X-Series™ Vertical Format Batch Cleaning Systems provide maximum chemistry flexibility to meet a wide variety of applications. Aqueous, saponification, semi-aqueous, alcohols and

Austin American Technology

TSM N70 Series Nitrogen Convection Reflow Ovens

TSM N70 Series Nitrogen Convection Reflow Ovens

New Equipment | Reflow

All in One N2 Reflow Oven. A next generation reflow oven that realizes ultra-low power consumption, the lowest N2 consumption and a high efficiency flux collecting system complying CO2 emission regulations. N2 Generator Fixing Type Easy M

Apex Factory Automation

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

New Equipment | Cleaning Equipment

The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.

Smart Sonic Stencil Cleaning Systems

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER® coreplus - Medium Size BGA Rework Station

New Equipment | Rework & Repair Equipment

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum

Finetech

EVS Solder Recovery Systems

EVS Solder Recovery Systems

New Equipment | Wave Soldering

Solder Recovery System Turns Dross into Dollars. The Solder Recovery System enables PCB manufacturers to recycle solder onsite directly from their wave solder machines. The EVS by Sono-Tek solder recycling system saves up to 50% in solder costs in

EVS International


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