New Equipment | ESD Control Supplies
NC-1000 is a biodegradable, non-toxic, non-flammable, non-alkaline, highly effective hard surface or rubber cleaner formulated with three biodegradable surfactants. These are designed specifically to neutralize, suspend, and remove heavy soils from r
New Equipment | ESD Control Supplies
Specially formulated to protect conductive/dissipative flooring, this finish will lengthen its life. It offers long lasting, high gloss, static dissipative properties. With low a VOC level this product is as safe as it is easy to use. Available in:
New Equipment | Solder Materials
Solder Preforms offers accurate solder deposition for various soldering processes. Reel packaging provides opportunity of automation for efficient application. Custom Material may be formulated to unique material and dimensional requirements. Specif
New Equipment | Solder Materials
DKL Metals have recently introduced their latest generation of Partner Paste formulations which have been designed specifically for use in Lead Free soldering. These pastes all give excellent print and reflow characteristics, tack life and stencil li
New Equipment | Cleaning Agents
AQUANOX® A4708 is a neutral range pH chemistry designed to rapidly clean under densely populated low-gap PWB assemblies. AQUANOX® A4708 is effective on all flux types including no-clean and water soluble residues. AQUANOX® A4708 is specifically form
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
New Equipment | Cleaning Agents
AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can be used in multi-p
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
High performance composite materials specifically designed for the PCB assembly process Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT r
Backed by a strong process and technology expertise, Technip has completed hundreds of projects from small units up to large chemical complexes. Through decades of experience, Technip has acquired considerable engineering expertise and a range of ca
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