Through the process of CNC routing, we are able to cut with precision electronic insulation products including thicker gauge materials. We also process composite materials such as G-10, FR4 and other materials that are not easily die cut.
This is LED multi group multi blade cutting machine CWVC-5 . It is an automated equipment and it can butt joint your production line equipment . It can cut all kind of board . 10 pcbs in one panel ,19 pieces blade can cut without any problem . Spe
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Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
FR4 PCB UV Laser Cutting Machine PCB Depaneling without Thermal Stresses Advantages The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameter
Specification for fpc punching tool : machine size 730 X 810 X 1700 mm Power supply(v): 110/220 Depression(Pa): 0.45-0.70 Weight(Kg): 530/700 Model CWPE Shipping way FO
Model CWVC-5 Max Cutting Length No limit Blade Material High speed steel Cutting Speed 400mm/s Cutting Thickness 1.0-3.5mm Voltage 220V or 110V LED Strip Depaneling Machine with
Details: PCB Depanel,CWVC-450/CWVC-480.pdf Specification: Max Cutting Length 480mm PCB Thickness 0.6-3.5mm PCB Material FR1, FR4, CEM1, CEM3, MCPCB Cutting Stress Less than 500 Mach
PCB Depaneling, CWVC-450 Specification: Max Cutting Length 480mm PCB Thickness 0.6-3.5mm PCB Material FR1, FR4, CEM1, CEM3, MCPCB Cutting Stress Less than 500 Machine Weight 280kgs
High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design. Reduce
PCB Depaneling Machine Description: With the advent of new and high power plus lower cost UV lasers there is greater adoption of cutting of materials like printed circuit boards. This boards may be produced from fiber glass materials like FR4 or f
