New SMT Equipment: fr5 glass transition (Page 1 of 1)

Axial Leaded Glass Encapsulated NTC Thermistor for Temperature Sensing, Measurement

Axial Leaded Glass Encapsulated NTC Thermistor for Temperature Sensing, Measurement

New Equipment | Components

Axial Glass NTC Thermistor Temperature Sensor is transition metal oxide material made semiconductor ceramic NTC Thermistor chip hermetically sealed in DO35 glass shell, with axial tinned Dumet wire, for temperature sensing measurement detection, indi

Amwei Thermistor Sensor

ThorLabs Inc. ASE-FL7200 Light Source Generators

ThorLabs Inc. ASE-FL7200 Light Source Generators

New Equipment | Test Equipment

ThorLabs Inc. ASE-FL7200 ASE FL 7200 White Light Test Source The ThorLabs ASE-FL7200 is a high-brightness white light test source. This high-brightness test source is designed to lproduce amplified spontaneous emission (ASE) ranging from 1440nm to

Test Equipment Connection

HTC - 300 High Temperature Carbon Ink for Screen Printing in Flex Circuits

HTC - 300 High Temperature Carbon Ink for Screen Printing in Flex Circuits

New Equipment | Materials

HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo

Conductive Compounds, Inc.

Fluxometer® Flux Application Measuring Tool

Fluxometer® Flux Application Measuring Tool

New Equipment | Wave Soldering

Maximizes Yields and Reduces Rework The ECD Fluxometer® maximizes yields and reduces rework by qualifying your spray fluxer pattern uniformity and top-side-penetration. Improve Process Quality - Eliminate guesswork when it comes to managing the c

Electronic Controls Design Inc. (ECD)

LPKF MicroLine 1120 S - Laser Depaneling System

LPKF MicroLine 1120 S - Laser Depaneling System

New Equipment | Depaneling

Laser Depaneling of Populated PCBs Low Cost Option for Depaneling Inexpensive Entry into UV Laser Processing The LPKF MicroLine 1120 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter

LPKF Laser & Electronics

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

New Equipment | Materials

EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle

Conductive Compounds, Inc.

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