Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Nanovea Mechanical Testers provide unmatched multi-function Nano and Micro/Macro modules on a single platform. Both the Nano and Micro/Macro modules include scratch tester, hardness tester and wear tester modes providing the widest and most user frie
Nanovea offers clients worldwide to an unmatched range of Nano, Micro & Macro Mechanical, Metallurgy, Tribology and 3D Non-Contact or AFM materials characterization. Measurements include: Scratch Adhesion, Indentation Hardness, Wear Friction, Elastic
Please visit our main microsectional analysis page for more information. Process Sciences uses microsection for both failure analysis and process validation. Our cross sections reveal intermetallic layers, defects, and other physical characteristic
New Equipment | Education/Training
Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With 30 pages and a compact size at 5.5 x 8.5 inch
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