Design for Manufacturability The Inovar team of Engineers will assist you in the design of your product to help you achieve the highest yields while speeding your time to market. Our experts will help take your product to the next level by trimming t
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New Equipment | Test Equipment
Key Features & Specifications Features •Supports GSM/GPRS/EGPRS/E-EDGE, W-CDMA/HSPA/HSPA+, cdma2000®/1xEV-DO/eHRPD, TD-SCDMA/TD-HSDPA/TD-HSUPA, IS-95, TIA/EIA-136 and AMPS wireless device testing. •Software upgradeable for quick access to new func
New Equipment | Test Equipment
The 5101B Multifunction Calibrator has the reputation of being an industry standard for calibration labs and a very cost effective way of performing meter calibrations to 4 1/2-digits. Provides five functions including direct or alternating volts or
BQC is an electronic manufacturing service (EMS) provider located in Shenzhen, China. We are providing total outsourcing solution to our international clients through value engineering and interactive design. BQC offer a full range of electronic ass
Turnkey Manufacturing, PCB Assembly and New Product Introduction experts. Lean Manufacturing experts. QS9000 certified for Automotive manufacturing. Apple Computer certified for PC components manufacturing. ISO-9002 certified. Industrial and com
Turnkey Manufacturing, PCB Assembly and New Product Introduction experts. Lean Manufacturing experts. QS9000 certified for Automotive manufacturing. Apple Computer certified for PC components manufacturing. ISO-9002 certified. Industrial and com
New Equipment | Assembly Services
Lead and RoHS (Lead-Free) contract manufacturing of rigid or flexible circuit board assembly and testing. Full turnkey and consignment manufacturing services capabilities include; EMS for Rigid, Felxible and Rigid Flex Assemblies Mechanical Assem
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
