New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Strain gage testing is utilized to evaluate materials and processes effect on PWB and component-level stress due to static and dynamic loads. These stresses can originate from sources such as thermal, mechanical, and/or a combination of the two. STI
Unprecedented combination of speed, accuracy and one-button simplicity for non-contact automated 3D scanning inspection. Dramatically Speeds Up Quality Assurance of Incoming Parts Inspection & In-Process Inspection of components on the manufacturing
vacuum pick-up systems are designed for delicate handling of small parts and components, including miniature, surface mount and chip scale packages. Features 1. vacuum pick & place systems using air only, 2.No electricity required for operation
The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS. Packaged in a rugged, bench top platform designed for show, engineered for the most advanced measurement requirements found withi
New Equipment | Board Handling - Storage
AGI has developed PCB Tray Storage Carts that are designed to be an integral part of your PCB storage and handling. The carts rugged design provides a protective source of transportation and storage for your populated PCBs. It features flexible stora
Ultimate Precision Accuracy With World-Class Usability. The SE600™ – CyberOptics’ flagship SPI system, is the most advanced, high performance system ever. SE600™ brings together best accuracy and world-class usability on a single platform – making i
World-Class Accuracy At Fastest Speed. The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor. An all-new, improved ultrafast sensor c
80 cm²/sec with zero compromise on measurement accuracy and repeatability. With SE500-D™ you can maximize production utilization and transform your production process to achieve high quality solder joints through accurate volume measurement of solde
winsouce.jpg)
