FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
UF 120LA: The Next-Generation High reliability, 100% flux residue compatible and reworkable underfill 02/03/2025 (Albany, NY) – YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With
UF 120LA: The Next-Generation High reliability, 100% flux residue compatible and reworkable underfill 02/03/2025 (Albany, NY) – YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Solder Paste Stencils
Solder Paste Printing Stencils The industry standard to manufacture solder paste stencils is to use Yag lasers with the capability to cut to a tolerance of +/- .0002". Stentech, with 12 Yag lasers across North America, can provide you the quality an
Substrate To Mask, Mask to Mask, Substrate To Substrate Interchangeable Vacuum Mask Holders Up to 17" Interchangeable Vacuum Chucks For Substrates Up To 16" Square, .3" Thick. Fixed Level And Planarizing Configurations, Fixed Or Removable Substrate
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