Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo
.jpg)
New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
| 1 |
.gif)
winsouce.jpg)