适用于大尺寸PCB板及双轨道生产的世界一流的SMT 回流焊炉 随着最新的技术突破，HELLER推出了全新的MARK 5回流焊系列，为客户提供了更为经济的方案。新型的加热和冷却技术能最大限度 地减少氮气和电力消耗，省氮省电高达40%。因此，MK5系列不仅性能卓越，更是业界最具经济价值的回流焊系列产品。 选择适合您制程需求的回流焊设备 1826MK5 回流焊炉 - 这些马力为高容量要求提供了稳定的性能，同时大大减少预防性保养的时间及空间占地。 1936MK5/2043MK5 回流焊炉 -
New Equipment | Cleaning Equipment
CM11 , CM 22, CM33. CM60 – Ionic Contamination and Cleanliness Test Systems to MIL & DEF standards.
New Equipment | Solder Materials
SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.
New Equipment | Test Equipment
The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST II) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability te
New Equipment | Cleaning Equipment
The Gensonic Stencil Cleaning System, awarded the European Product of the Year at Productronica 2013, is a manually operated ultrasonic transducer unit for cleaning stencil apertures. The Gensonic can be used either in conjunction with our Stencil Cl
The Solder-Saver offers companies that use wave soldering the opportunity to instantly recycle dross created in the wave solder pot, thereby saving up to 50 percent in new solder bar purchases. It can be used with leaded, lead-free or unleaded wave s
New Equipment | Test Equipment
For over 40 years the Benchmark for Ionic Contamination Testing Commonly referred to "Cleanliness Testing" as this test method has, for over 40 years, been acknowledged as an important Quality Assurance and Process Control tool in the manufacture of
New Equipment | Coating Equipment
3% accuracy Being totally air operated the NEW Nano-Coat Dip Systems are totally safe to use with all coatings including flammable liquids and for the very widest range of applications. Dip coating is the most effective method of applying a confor
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
New Equipment | Cleaning Agents
CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS
