New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
When integrated in the production line, provides 100% verification of absence and presence of glue dot dispensing before entering the placement. ScanINSPECT ADI provides 100% verification of absence/presence of glue dot dispensing before entering t
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides dimensionally stable support platform for PCB * Protects SMT components from heat or thermal shock * Reduce/eliminate manual labor for hand masking operation, glue dotting, and hand soldering * Reduce solder defects (ex. Bridges and skips)
New Equipment | Solder Materials
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process
iJet-Table Dispenser Model 250 & 350: SMT and PCB Packaging, Underfill, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the n
Underfill, FPC, Glob Top, Dam & Fill, Surface Mount Adhesive, LED Packaging, BGA Edge Bonding, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated. Viscosity Contr
SMT and PCB Packaging, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated.
Increased Dispense Area over SD6 Series for Underfill, Glob Top, Dam & Fill, LED Packaging, Surface Mount Adhesive Dispensing, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down
New Equipment | Solder Materials
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process
High speed, precision dispensing by digital and cam drives. High speed, precision dispensing: 0.08 sec./dot saves floor space due to compact design. Glue is charged with compressed air at a high speed and the advanced cam-link head mechanism is abl
