New SMT Equipment: glue dots (Page 1 of 2)

Precision Auger Pump

Precision Auger Pump

New Equipment | Dispensing

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

ScanINSPECT ADI - Automatic Dispense Inspection Station

ScanINSPECT ADI - Automatic Dispense Inspection Station

New Equipment | Inspection

When integrated in the production line, provides 100% verification of absence and presence of glue dot dispensing before entering the placement. ScanINSPECT ADI provides 100% verification of absence/presence of glue dot dispensing before entering t

ScanCAD International, Inc.

Wave Solder Pallets

Wave Solder Pallets

New Equipment | Board Handling - Pallets,Carriers,Fixtures

* Provides dimensionally stable support platform for PCB * Protects SMT components from heat or thermal shock * Reduce/eliminate manual labor for hand masking operation, glue dotting, and hand soldering * Reduce solder defects (ex. Bridges and skips)

Shenzhen Sunshine Laser Technology

SM-150G/SM-155P Epoxy Adhesives

SM-150G/SM-155P Epoxy Adhesives

New Equipment | Solder Materials

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process

Shenmao Technology Inc.

iJet-Table Fluid Dispenser

iJet-Table Fluid Dispenser

New Equipment | Dispensing

iJet-Table Dispenser Model 250 & 350: SMT and PCB Packaging, Underfill, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the n

Anda Automation Pte Ltd

iJet-6 Jet Dispensing Fluid Dispensing System

iJet-6 Jet Dispensing Fluid Dispensing System

New Equipment | Dispensing

Underfill, FPC, Glob Top, Dam & Fill, Surface Mount Adhesive, LED Packaging, BGA Edge Bonding, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated. Viscosity Contr

Anda Automation Pte Ltd

iJet-8 Multi-function Jetting Dispenser

iJet-8 Multi-function Jetting Dispenser

New Equipment | Dispensing

SMT and PCB Packaging, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated.

Anda Automation Pte Ltd

iJet-9 Large Platform Jet Dispenser

iJet-9 Large Platform Jet Dispenser

New Equipment | Dispensing

Increased Dispense Area over SD6 Series for Underfill, Glob Top, Dam & Fill, LED Packaging, Surface Mount Adhesive Dispensing, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down

Anda Automation Pte Ltd

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G / SM-155P Single Component Epoxy Adhesive

New Equipment | Solder Materials

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process

Shenmao Technology Inc.

HITACHI TDM-3000-3500E Dispenser

HITACHI TDM-3000-3500E Dispenser

New Equipment | Dispensing

High speed, precision dispensing by digital and cam drives. High speed, precision dispensing: 0.08 sec./dot saves floor space due to compact design. Glue is charged with compressed air at a high speed and the advanced cam-link head mechanism is abl

Hitachi High Technologies America, Inc.

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