New SMT Equipment: gold embrittlement immersion silver (Page 1 of 6)

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

New Equipment | Surface Finish

Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed

Technic Inc.

Multi-Layer FR4 PCBs

Multi-Layer FR4 PCBs

New Equipment | Printing

1~26 layers, High Mix low volume to Mass production. FR4-Tg140~200. Surface finish OSP, Immersion gold, Immersion silver, Immersion tin, Hard gold plating etc. Finish copper up to 6oz. HDI 2+N+2 Capability.

PingYork Technology & Resources Inc

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Multilayer PCB

Multilayer PCB

New Equipment | Inspection

Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width

Multycircuit Technology Limited

2 Layer FPC

2 Layer FPC

New Equipment | Components

Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD

Headpcb

Printed Circuit Manufacturing

New Equipment |  

Ridgid, bare board manufacturing of military, high reliability, quick-turn, prototype, single, double-sided, and multilayer boards, blind and buried vias, carbon ink, immersion silver, immersion tin, reflow, hasl, nickel and gold, all colors of legen

Circuit Center, Inc.

OEM Rigid Flex PCB Assembly Hard Gold Plating Rigid Flexible PCB

OEM Rigid Flex PCB Assembly Hard Gold Plating Rigid Flexible PCB

New Equipment | Assembly Services

• Place of Origin: Guangdong, China (Mainland)  • Brand Name: ShanXu  • Model Number: FPC RoHS Compliant  • Number of Layers: Single-sided, Double-sided, Multi-layers and Flex-Rigid PCB  • Base Material: Polyimide(Kapton), Polyester(PET), FR4  • Copp

Shanxu Shortcut HK Group Ltd

Multilayer PCB

Multilayer PCB

New Equipment |  

Materials: FR4 ,Aluminium,FPC layer: 1-12 Board thickness: 0.4-4.2mm Copper:0.5-3oz Finishing: Plating gold,immersion gold,immersion silver,Pb free HAL,OSP, Min.hole size: 0.10mm(Blind and burried hole available) Min. Line/Space: 0.10mm/0.10mm The

Cirket Electronics Co.,Ltd

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High Throughput Reflow Oven