New Equipment | Surface Finish
Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed
1~26 layers, High Mix low volume to Mass production. FR4-Tg140~200. Surface finish OSP, Immersion gold, Immersion silver, Immersion tin, Hard gold plating etc. Finish copper up to 6oz. HDI 2+N+2 Capability.
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
Ridgid, bare board manufacturing of military, high reliability, quick-turn, prototype, single, double-sided, and multilayer boards, blind and buried vias, carbon ink, immersion silver, immersion tin, reflow, hasl, nickel and gold, all colors of legen
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
General specification for Microwave/RF PCB Layer count: 1-6 Board thickness: 0.2-3.2mm Copper thickness: 0.5-4oz Dielectric Constant(DK): 2.2-10.3 Min trace width/spacing: 4/4mil Min drill hole size: 0.2mm Surface treatment: HAL(Lead free), I
