New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
FR-4 Material 2.4 mm Thickness 4 Layers Lead Free Surface Treatment Red Solder Mask Gold Finger
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi
Gold finger PCB/Impedance computer circuit board Layer:6 Thiness: 2.0mm Surface treatment: ENIG+Hard gold plated on gold finger Impdance control: Single-ended 50ohm, differential 90 ohm Application: Computer
REPAIR & REWORK OF GOLD CONTACTS, E.G. GOLD FINGER,CONNECTORS, SOLDER ON GOLD PROBLEM, COSTUME JEWELLERY, DENTAL, OPTICAL, ETC.
Applications include protection of gold fingers, component hold down, etc. Product list is available.
New Equipment | Assembly Services
Technic Feature Layer Count:6 Layer Board Thicknes:1.57mm Surface Finish：HASL+Gold Finger Application Field:Computer display card
New Equipment | Fabrication Services
Base Material: FR4 Layer count: two layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish:Gold finger Soldermask Colors: Red Size:119.5*76.7/1up
FR4 2. 0mm, red soldermask, Immersion gold+golden finger
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
