New SMT Equipment: gold thickness wire bond (Page 1 of 4)

IPC Standards

IPC Standards

New Equipment | Education/Training

IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics

Association Connecting Electronics Industries (IPC)

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

New Equipment | Inspection

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

China multilayer gold finger pcb prototype manufacturer

China multilayer gold finger pcb prototype manufacturer

New Equipment | Fabrication Services

Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board 

Shenzhen Kingsheng PCBA Tech CO.,Ltd.

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

AlSi Bonding Pads

AlSi Bonding Pads

New Equipment | Materials

Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas

Heraeus Materials Singapore Pte Ltd

S2088BO-II – Reliable Wirebond Control with Desktop AO

S2088BO-II – Reliable Wirebond Control with Desktop AO

New Equipment | Inspection

This compact AOI system was developed to inspect medium and small product runs. During inspection, a high-resolution camera records all bond sites and wires. Dies, bond sites, wire course and component position are only a part of the inspection scope

Viscom AG

SMT Assembly, Aluminum Bonding Wire

New Equipment |  

Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole

Advanced Electronics Co.,Ltd.

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

Multichip modules (MCM-L)

New Equipment |  

Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.

Metro Circuits, div. of PJC Technologies, Inc.

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

New Equipment | Surface Finish

Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed

Technic Inc.

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