New SMT Equipment: golde (Page 7 of 1012)

QSX-79T Gold Tester - XRF Analyzer

QSX-79T Gold Tester - XRF Analyzer

New Equipment | Test Equipment

The lowest cost XRF system; gold assay equipment This compact x-ray fluorescence analyzer provides everything that a company testing for gold content needs.  It has been developed with easy to use software that provides a straight forward testing o

Quickshot XRF

A type battery contact spring 0.15mm spring steel with gold plated

A type battery contact spring 0.15mm spring steel with gold plated

New Equipment | Components

A type battery contact spring 0.15mm spring steel with gold plated many thickness and types available  automatic tape reel package  competitive price and fast lead time  Made in Shenzhen China  website :www.jingyiprecision.com

Jingyi Precision Technology Co.,ltd

0.15mm Gold plated A type battery contact clip

0.15mm Gold plated A type battery contact clip

New Equipment | Components

A type battery contact spring 0.15mm spring steel with gold plated many thickness and types available  automatic tape reel package  competitive price and fast lead time  Made in Shenzhen China  website :www.jingyiprecision.com

Jingyi Precision Technology Co.,ltd

PCB Prototype - 2 Layer, Metal Core Board, Hard Gold Plating 30u

PCB Prototype - 2 Layer, Metal Core Board, Hard Gold Plating 30u", With Black Solder Mask

New Equipment | Assembly Services

PCB Prototype - 2 Layer, Metal Core Board, Hard Gold Plating 30u", With Black Solder Mask - 2 layer, metal core board, hard gold plating 30u", with black solder mask. Advantages: - Metal core board. A PC board to be populated with electronic compo

D-Ying Electronic Inc.

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

FWF10003 Wafer 1mm 180°Vertical (SMT)(Gold-Plated)

FWF10003 Wafer 1mm 180°Vertical (SMT)(Gold-Plated)

New Equipment | Components

Category Category Wafer 180°Vertical (SMT) Circuits 10,12,16,20,30,40,50 Pitch 1.0mm Height 4.35mm Electrical Current Rating 1.0A AC(rms)/DC(AWG32) Voltage Rating

Beijing Yuanda Innovation Technology Co., Ltd

FWF10004 Wafer 1mm 90°Angle (SMT)(Gold-Plated)

FWF10004 Wafer 1mm 90°Angle (SMT)(Gold-Plated)

New Equipment | Components

Category Category Wafer 90°Angle (SMT) Circuits 20,30,40,50 Pitch 1.0mm Height 5.5mm Electrical Current Rating 1.0A AC(rms)/DC(AWG32) Voltage Rating 50V AC(rms)/

Beijing Yuanda Innovation Technology Co., Ltd

FWF10007 Wafer 1mm 180°Vertical (SMT)(Gold-Plated)

FWF10007 Wafer 1mm 180°Vertical (SMT)(Gold-Plated)

New Equipment | Components

Category Category Wafer 180°Vertical (SMT) Circuits 10,12,16,20,30,40,50 Pitch 1.0mm Height 4.3mm Electrical Current Rating 1.0A AC(rms) Voltage Rating 50V AC(rm

Beijing Yuanda Innovation Technology Co., Ltd

FWF12002 Wafer 1.20mm 90°Angle (SMT)(Gold-Plated)

FWF12002 Wafer 1.20mm 90°Angle (SMT)(Gold-Plated)

New Equipment | Components

Category Category Wafer 90°Angle (SMT) Circuits 2-6 Pitch 1.2mm Height 1.45mm Electrical Current Rating 2.0A AC(rms) Voltage Rating 50V AC(rms)/DC Conta

Beijing Yuanda Innovation Technology Co., Ltd

NanoSlic™ Gold Stencils

NanoSlic™ Gold Stencils

New Equipment | Printing

NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste

Fine Line Stencil, Inc.


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