New SMT Equipment: golde (Page 8 of 1012)

Grid-Lok Gold™ - Fully Automatic Pnuematic PCB Support

Grid-Lok Gold™ - Fully Automatic Pnuematic PCB Support

New Equipment | Assembly Services

Premium Automatic PCB Support for SMT Processes Ovation’s award-winning Grid-Lok Gold™ automatic substrate support technology provides electronics manufacturers with a robust alternative to costly and often problematic dedicated fixture plates. Set

Ovation Products

NxGenElectronics.com

NxGenElectronics.com

New Equipment |  

Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging

NxgenElectronics

TX-2

TX-2

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 6 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 6 mil Finishing: Immersion Gold + Hard Gold

Zhuhai Camtech Circuit Co., Ltd

INTERNATIONAL MARKETING SYSTEM

INTERNATIONAL MARKETING SYSTEM

New Equipment | Education/Training

Create your passive income in the company EmGoldex.  For anyone who is going to grow as a person and get a  6,500 euro per month!   Online store selling, gold bars from 1 to 100 grams in the bonus program. Create your own business!  http://goldpu

EMGOLDEX.COM - Emirates Gold Exchange

Multi-Layer FR4 PCBs

Multi-Layer FR4 PCBs

New Equipment | Printing

1~26 layers, High Mix low volume to Mass production. FR4-Tg140~200. Surface finish OSP, Immersion gold, Immersion silver, Immersion tin, Hard gold plating etc. Finish copper up to 6oz. HDI 2+N+2 Capability.

PingYork Technology & Resources Inc

Golden Finger PCB

Golden Finger PCB

New Equipment | Fabrication Services

Project Description | Parameters 10 Layer  Thickness: 1.6+/-0.16 mm Min Hole Size: 0.15 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: ENIG+Gold Finger | Craft Red Ink Gold Finger | Application Industrila Control

Headpcb

Flexible PCB Cable

Flexible PCB Cable

New Equipment | Fabrication Services

Project Description | Parameters 4 Layer  Thickness: 0.25+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.2mm/0.15 mm Surface Treatment: Flash Gold plating | Craft Flash Gold plating Different Thickness Stiffener Lamination | Application Power Hat C

Headpcb

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

Universal GSM 56mm feeder

Universal GSM 56mm feeder

New Equipment | Other

Universal GSM 56mm feeder Universal feeder Siemens 3x8mm Silver feeder 00141098 SMT feeder Universal pick and place machine Product description: Universal GSM 56mm feeder Universal GSM 56mm feeder Specifications: 49889214 - 8 mm High

Flasonsmt Co.,ltd

Welding Machine Immersion Gold PCB Prototype / PCB Manufacturer China

Welding Machine Immersion Gold PCB Prototype / PCB Manufacturer China

New Equipment | Prototyping

Supplier: Shenzhen Grande Electronic Layers: 4 Application: Welding Machine Immersion Gold PCB Prototype / PCB Manufacturer China PCB Parameter: FR-4/HTG150 Thickness:1.6mm Surface Treatment: Immersion Gold Testing: 100% E-test Package: Vacuum packi

Shenzhen Grande Electronics Co., Ltd


golde searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for handload Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
consignment program

High Resolution Fast Speed Industrial Cameras.
High Throughput Reflow Oven

Easily dispense fine pitch components with ±25µm positioning accuracy.
Void Free Reflow Soldering

Software for SMT placement & AOI - Free Download.