New SMT Equipment: golde (Page 10 of 1012)

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

New Equipment | Surface Finish

Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed

Technic Inc.

FHG08001 Wire to board housing 0.8mm

FHG08001 Wire to board housing 0.8mm

New Equipment | Components

Category Category Wire to board housing Circuits 2-14,16,.20 Pitch 0.8mm Wafer/Housing FWF08001,FWF08002 Terminal / Electrical Current Rating 1.0A AC(rms)

Beijing Yuanda Innovation Technology Co., Ltd

Universal DISPLAY DRIVER PCB 2 REV D 25327000

Universal DISPLAY DRIVER PCB 2 REV D 25327000

New Equipment | Other

Universal DISPLAY DRIVER PCB 2 REV D 25327000 Universal DISPLAY DRIVER PCB 2 REV D 25327000 SMT Spare Parts Siemens Spare Parts Delivery time: 1-3 days Product description: Universal DISPLAY DRIVER PCB 2 REV D 25327000  INQUIRY Universa

Fomyn Equipment co,.ltd

HANDY & HARMAN

New Equipment |  

Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...

West-Tech Materials

Multichip modules (MCM-L)

New Equipment |  

Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.

Metro Circuits, div. of PJC Technologies, Inc.

ELV-AWAY Products Tape

New Equipment |  

Applications include protection of gold fingers, component hold down, etc. Product list is available.

Lost River Products Company

long wave infrared reflow and curing ovens

New Equipment |  

IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2

ROBOTHERM

Multilayer PCB

Multilayer PCB

New Equipment |  

Materials: FR4 ,Aluminium,FPC layer: 1-12 Board thickness: 0.4-4.2mm Copper:0.5-3oz Finishing: Plating gold,immersion gold,immersion silver,Pb free HAL,OSP, Min.hole size: 0.10mm(Blind and burried hole available) Min. Line/Space: 0.10mm/0.10mm The

Cirket Electronics Co.,Ltd

Siemen's 3X8 feeder

New Equipment |  

used Siemen's 3X8 feeder. Gold & silver. used Siemen's 2X8 feeder.

SMT Concept Technology

PCB-02

PCB-02

New Equipment |  

Material: FR-4 Layer Coverage: 2L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green

Shenzhen Longkun Technology Co.,Ltd


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