The Agilent Medalist 5DX Series 5000 offers 3-D Automatic X-Ray inspection capability, enabling inspection of both sides of a double-sided panel in one pass. Customer CAD is converted to an inspection program, enabling 100% solder joint inspection t
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for
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