New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework NEW! Movable top and bottom gas heaters. NEW! All Shuttle Star BGA Rework Stations are now available with Cabinet Base on wheels. For high volume BGA Rework on even the largest computer a
Singulate Straight Tab Routed Panels Store cut tabs inside tool for discarding at operator convenience Available with 3 blade types and choice of support dies Clean cut - requires no rework for deburring PCB edges Easy blade change in under 5 m
2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,
Ersa HOTFLOW 3/20 SMT Reflow Oven Working width: 45-580 mmProcess length: 5,190 mmHeated length: 3,700 mmCooling length: 1,490 mmWeight appr. 3,200 kgDimension: 6,590x1,530x1,450 mm Ersa HOTFLOW 3/20 SMT Reflow Oven Ersa HOTFLOW 3/20 SMT Refl
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New Equipment | Cleaning Equipment
Fully Automatic Stencil Cleaning System BMP-750 Features ▶All stainless steel body, beautiful, wear resistance, corrosion resistance, in line with environmental protection requirements and standards. ▶The fully pneumatic operation, no electricity, t
Ersa HOTFLOW 3/20e SMT Reflow Oven Working width: 45-516 mm Process length: 4,840 mm Heated length: 3,725 mm Cooling length: 1,115 mm Weight appr. 1,900 kg Dimension: 6,265x1,201x1,375 mm Ersa HOTFLOW 3/20e SMT Reflow Oven Ersa HOTFLOW 3/20e S
