The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
High Speed Flexible Mounter T8E Unique advantages of Pick and place machine T8E: 1. Can mount up to 114 kinds of components at most. 2.Standard configuration can mount SMD 0201 and above size. 3.The max size of QFP :48*48mm. 4.Can mount BGA ,CSP
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