New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
New Equipment | Solder Paste Stencils
Our DEK Green Monster understencil wiping rolls are comprised of coarse rayon and ESD polyester bonded by a tough proprietary formula of copolymers to make a fabric of high integrity ESD GREEN MONSTER!™ is the only stencil wiping roll to be truly E
New Equipment | Solder Paste Stencils
Our MPM / Speedline Green Monster Understencil Wiping Rolls are comprised of coarse rayon and ESD polyester bonded by a tough proprietary formula of copolymers to make a fabric of high integrity ESD GREEN MONSTER!™ is the only stencil wiping roll t
New Equipment | Solder Paste Stencils
Our EKRA Green Monster Understencil Wiping Rolls are comprised of coarse rayon and ESD polyester bonded by a tough proprietary formula of copolymers to make a fabric of high integrity ESD GREEN MONSTER!™ is the only stencil wiping roll to be truly
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i
Automated 2D & 3D inspection, variable magnification, high defect detection, low false calls, fast throughput, quick set-up. The Xi3400 is the latest addition to Nordson’s comprehensive range of test and inspection equipment for electronic device ma
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
