General specification for Microwave/RF PCB Layer count: 1-6 Board thickness: 0.2-3.2mm Copper thickness: 0.5-4oz Dielectric Constant(DK): 2.2-10.3 Min trace width/spacing: 4/4mil Min drill hole size: 0.2mm Surface treatment: HAL(Lead free), I
New Equipment | Cleaning Equipment
The Atmospheric Pressure Plasma (AP Plasma) designed by professional engineers in an eco-friendly environment to completely remove any kind of organic pollutants. The unique design features and certified R&D patterns will increase surface bounding tr
New Equipment | Assembly Services
Material: FR-4 Layer: 2 Board thickness: 1.0 mm Copper: 1 oz Surface finish: LEAD FREE HASL Min through hole: 0.3 mm Min line width: 0.3 mm Min line space:0.3 mm Soldermask color: Green Silkscreen color: white RoHS certificate
New Equipment | Assembly Services
Material: FR-4 Layer: 2 Board thickness: 1.0 mm Copper: 1 oz Surface finish: LEAD FREE HASL Min through hole: 0.3 mm Min line width: 0.3 mm Min line space:0.3 mm Soldermask color: Green Silkscreen color: white RoHS certificate
New Equipment | Cleaning Agents
AQUANOX® A4625B is an innovative aqueous chemistry designed for optimum effectiveness in batch washers. This easy to use product will remove all types of electronic flux residues including the latest lead free. AQUANOX® A4625B is environmentally fri
Aluminium PCB Materials: Aluminium.This material is made in China and has big competitive price. Layer Number: 1 Board thickness: 1.0mm Surface technique: Pb free HAL Minimum hole size: 0.30mm Minimum Line/Space: 0.25mm/0.25mm Solder mask: Blac
Product Characteristics: With the latest non-woven technology from USA made of 55% cellulose and 45% polyester, polyester/rayon composite non-woven fabrics, roll design, strong tensile strength, dirt-free, lowest scraps, high absorbency. Good for c
New Equipment | Cleaning Agents
KYZEN® E5321 is a room temperature pallet and maintenance cleaning agent. This cost effective chemistry removes all types of solder paste and flux residues, including baked on and hardened lead free high temperature flux residues from wave pallets an
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
