1��Materials��FR-4��CEM-1�� High-Tg170, Teflon, Aluminum-base, Iron-base 2��Layers: Single, Double Side, Multi Layers (Less than 22 Layers) 3��Finished Surface: HAL,Lead Free HAL, Immserion Gold,Plating Flash Gold, O.S.P., Gold-Finger, Carbon Ink, P
Petroferm offers a complete line of aqueous and semi-aqueous cleaning chemistries for use in batch and inline spray-in-air cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
The BMP53 Label Maker is a compact, versatile portable printer with built-in Bluetooth® technology for wireless printing. When used in conjunction with the free Brady Mobile App, you can design and print labels with this printer using your Android ph
FEATHERS 1. It is used to cut radial leads of the unilateral taped radial components. (roll-/box-packaged) 2. It has small volume and is easy to operate. 3. It works accurately and is easy to adjust. 4. Made of steel materials imported from
New Equipment | Coating Materials
70% humidity 120 -40°C to 105°C Urethanes HYSOL PC18M Flexible one-component solvent-based urethane coating which may be cured at room temperature. Meets MIL-I- 46058C. 2 h
New Equipment | Education/Training
Second edition of the CD provides a guide to all aspects of wave soldering with all the common process defects. Each stage of the process including fluxing, pre heat, solder wave and conveyors are explained along with materials used and the changes n
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Cleaning Agents
220°F~104°C Boiling Point 280°F~138°C Water Soluble Complete VOC, @10% 90.0 g/L Typical Processes: Application Spray
New Equipment | Cleaning Agents
220°F/104°C Boiling Point 240°F/115°C Water Soluble Complete VOC, @10% 88.9 g/L Typical Processes: Application In-Line
