New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
FR-4 Material 2.4 mm Thickness 4 Layers Lead Free Surface Treatment Red Solder Mask Gold Finger
Please visit our main microsectional analysis page for more information. Process Sciences uses microsection for both failure analysis and process validation. Our cross sections reveal intermetallic layers, defects, and other physical characteristic
Materials: Rogers 4003C Layer count: 2 layers;60 mil thick Application: Microwave communications Finishing: Leadfree HASL
New Equipment | Assembly Services
Technic Feature Layer Count:6 Layer Board Thicknes:1.57mm Surface Finish：HASL+Gold Finger Application Field:Computer display card
New Equipment | Fabrication Services
Base Material: Aluminium Layer count: ten layer Board thickness: 3.0mm Copper Thickness:2 oz Surface finish: HASL Soldermask Colors: White
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
1). Size: 45*140mm/1 up 2). Layer count: 2 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/space 7). Pads finish: HASL 8).
FR-4 Material 1. 0 mm Thickness 1oz copper thickness 4 Layers HASL Surface Treatment Green Solder Mask e-test
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
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