New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Convection Heating Pressure Curing Ovens for a variety of pressure curing needs. Heller offers a variety of pressure curing ovens with different chamber sizes suitable for both R&D and high volume manufacturing applications. Multiple cleanroom and au
Automatic Dispensing Machine Glue Dispenser Robot For Electronic Factory Working Principle: Putting 50ml package hot melt adhesive into specific heater, using dispensing controller to extrude glue and 3-axis robot to complete dispensing path. F
Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Lead-Free Desktop Reflow Oven with tempereture cure T200N+ Product Description Product Description: T200N+=nitrogen lead free reflow oven T200N+temperature tester T200N+ is not o
New Equipment | Curing Equipment
Anda iCure series of curing ovens are compact, inline Infrared (IR) curing systems. These IR curing ovens are suitable for high volume, rapid curing of heat curable coatings, adhesives, and inks., etc. Models: iCure-2 (2 zones) iCure-3 (3 zones)
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
New Equipment | Curing Equipment
TrioTek™ inline heat curing ovens from ETS are ideal for medium to high-volume curing, baking or drying of conductive inks, conformal coatings,adhesives, encapsulants and potting compounds. They are easy to integrate with automated spray and dispense
A tough, 60 duro Shore 00 transparent gel silicone RTV product. A easy 1:1 mix can be heat or R.T. cured in minutes for dust, shock, moisture, vibration and heat insulation.
New Equipment | Coating Materials
Conformal coatings for printed circuit boards cure tack free in seconds upon exposure to UV/Visible eliminating the time-consuming steps of traditional thermal-cure and room-temperature-cure conformal coatings. Coatings are available for tin whisker
Near Equilibrium Hot Gas Heating makes the CUREFLOW series the only choice for SMT Convection reflow and curing applications. 3 models to choose from.
