Formed parts are used for electrical insulation, such as snap-in-place housings, protection of high voltage parts, or covering bus bars. Plastics Forming Methods: Heated line bending Press brake cold forming Perforating for bend in plac
Straight Fin BGA Heat Sink (High Aspect Ratio Ext.) High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduc
Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extruded aluminum, which minimizes thermal resistance from th
BGA Heat Sink (High Aspect Ratio Ext.) High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance fro
We make a variety of Metal Stampings specializing in Connectors, Switches, Terminals, Heat sinks, RFI/EMI shielding, Lead frames, Battery contacts and Spring contacts
Thermally conductive silicone adhesive sealant. 1-Part RTV, neutral cure, fast cure, fast on-set of adhesion for PC board & component heat sink, part fixturing, vibration & moisture insulation, as well as the adhesive sealing of components.
Aluminium based, good heat sink
The BWT-104WA is a research quality, open loop, benchtop wind tunnel for thermal characterization of components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates. The polynomial shape and internal flow management
dataCon procures to print all sheet metal designs, extruded shapes and stamped or machined parts to be assembled. Upon receipt, parts are stocked or binned by customer part number until requested by work order or shop floor personnel. Screws, nuts,
New Equipment | Rework & Repair Equipment
4-BANK IR PCBOARD PREHEATER. The FR-872 is a low profile, bench-top PCBoard preheater designed to elevate the temperature of printed circuit board assemblies so that components on them can be soldered and de-soldered more easily, and with improved
