1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend 6). Immersion gold. 7). Stack-up ---------- OVERLAY (TOP) ---------- SOLDER MASK (TOP)
eavy copper board Material FR-4 Layers : 2 Trace width/space : 10 mil/10 mil Copper thickness 5/5 oz Application : High Voltage power Supply
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This is a 2-layer 20 ounce Heavy copper PCB used in Hi-Power applications.
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Heavy Copper Printed Circuits supplier Saturn Electronics Corp., bare printed circuit board manufacturer, was one of North America's largest users of heavy copper PCB laminate, which we used in the bare PCB manufacturing of Power Distribution Boards
Heavy copper PCB/ Power supply PCB Layer: 4 Material: FR4(Tg170) Finished copper thiness:4oz on each layer Min. trace width/spacing: 0.3/0.4mm(12/16mil) Application: Power controls, heat dissipation
Layer count of mass production is 1L to 26L, including regular PCB, heavy copper PCB, Aluminum/Copper based PCB, Hybrid PCB, HDI etc.Applications cover power supply, telecom,fiber optics, industrial control, Auto, consumer electronics Most of the pro
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Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications
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Aluminium PCB ︱PCB manufacturing︱Multilalyer PCB ︱Aluminum PCB︱Metal core PCB︱High density PCB, High Density Interconnect PCBs (HDI PCBs) ︱HDI board, HDI PCB︱PCB, printed circuit board, printed wiring board, rigid PCB︱Multilayer printed circuit board
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High density PCB, High Density Interconnect PCBs (HDI PCBs) ︱HDI board, HDI PCB︱PCB, printed circuit board, printed wiring board, rigid PCB︱Multilayer printed circuit board︱Heavy copper PCB︱Flexible PCB, FPCB︱rigid-flex PCB, Flex-rigid PCB︱Bergquist
New Equipment | Fabrication Services
1. Manufacture multilayer PCB, specializing in quick-turn prototype and small-medium volume. 2. Key products are 2-20 rigid layers, high TG, high-frequency, impedance control, half holes, countersink holes, blind & buried via, Al/Cu based,
