New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS. Packaged in a rugged, bench top platform designed for show, engineered for the most advanced measurement requirements found withi
New Equipment | Tape and Reel Equipment
Peel Force Tester Model: PL425 Specification: Peel angel: 165-180 degree Pull length: 50-200mm Japan ALGOL electronic Rally: display range MAX 1000.0 gf. Test speed: Max 300mm / min Power: single-phase AC 110V / AC 220V. Dimensions (mm): Le
Ultimate Precision Accuracy With World-Class Usability. The SE600™ – CyberOptics’ flagship SPI system, is the most advanced, high performance system ever. SE600™ brings together best accuracy and world-class usability on a single platform – making i
With SE500-X™ - 100% 3D solder paste inspection system, CyberOptics pushes inspection speed to the highest level possible. The SE500-X™ is capable of inspecting the most demanding assemblies with 80cm²/sec inspection speed without compromising on mea
Symbion P36 is an inline high-speed API solution that delivers 100% coverage for improving your product quality and boosting your productivity. Post-Paste AOI Instant Programming Easy Gerber Import 2D/3D Laser Path Superior POP™ D
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
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