Heating system (Heller 1812EXL ) 1. All the heating zones are controlled by PLC through PID 2. Heating separately according to different zones is workable to reduce starting power. 3. Turbo air system can improve air flow and provide high rising t
M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Model: EP-1 1510, EP- 2010 and EP-2515 EP-1 series profile projector is one kind of high precision measuring instrument, which is unified with optic, precision machinery and electronic measurement, mainly used for measuring and inspecting the size,
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
The LaserVision Mini SP3D system combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of the SMT stencil printing process. With its Windows® 7+ Pro OS and service free USB interface, the Mini SP3D system is e
Managing the Ultimate Reflow Oven Output. The KIC RPI helps manage reflow ovens to consistently maximize the desired results. In addition, the RPI provides process deficiency information in order to help users correct their defect issues quickly. T
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
