is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems. It is recommended for wave solder process and ros
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
New Equipment | Solder Materials
Cored Solder Wire is specially designed with low residue, chlorine content less than 0.1%, flux content 2.0%+0.5 for Hand/Automatic soldering applications assembly. Soldering Wire is available in many alloy composition, Sn60 and Sn63 are the most re
New Equipment | Cleaning Agents
IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur
New Equipment | Solder Materials
ALPHA® EF-Series fluxes offer environmentally friendly benefits, while providing unmatched soldering performance. The ALPHA soldering flux line is unsurpassed in providing wave soldering process solutions. Its alcohol-based fluxes provide excellent w
New Equipment | Cleaning Agents
CYBERSOLV® C8882 is a fast-acting stencil cleaning solvent designed for the understencil wipe process. CYBERSOLV® C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. CYBERS
New Equipment | Solder Materials
Alpha has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies. The range includes no-clean, water-soluble and activated rosin fluxes in a variety of solder alloys. A
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Cleaning Agents
CYBERSOLV® 141-R is a precision cleaner blend of organic solvents that is safe and ready to use for bench-top electronics cleaning. CYBERSOLV® 141-R is effective on a wide variety of soils typically found in electronic assembly and maintenanc
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