New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
New Equipment | Soldering Robots
The premium model that achieves fast, precise, and high-quality soldering operation. Offering two slim types of high performance soldering robots that letting our customers choose the best one to fit their objectives. Both come with a clean cut feed
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
New Equipment | Solder Materials
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder
TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation, fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, due to metal's hi
New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
New Equipment | Wave Soldering
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
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