New SMT Equipment: high temp solder paste (Page 8 of 19)

AMT Solder Powder

AMT Solder Powder

New Equipment | Solder Materials

Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low

AMTECH

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

VisionPro AP500 - Automated 3D SPI

VisionPro AP500 - Automated 3D SPI

New Equipment | Inspection

Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and

ASC International

Mydata MY600 High-Speed SMT Jet Printer

Mydata MY600 High-Speed SMT Jet Printer

New Equipment | Printing

MY600 - Millions of dots ahead of its time. The next-generation MY600 Jet Printer now enables SMT producers to achieve optimal solder joints on complex boards at speeds of more than one million dots per hour, a 50% increase in throughput compared to

Mycronic AB

ERSA VERSAPRINT 2 Stencil Printers

ERSA VERSAPRINT 2 Stencil Printers

New Equipment | Printing

A Revolutionary Print Solution with Integrated Post Print AOI The VERSAPRINT series not only handles the automatic cleaning of the underside of the stencil and inspection of the printing result, with a choice of 2D or 3D inspection, it also carries

kurtz ersa Corporation

NanoSlic™ Gold Stencils

NanoSlic™ Gold Stencils

New Equipment | Printing

NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste

Fine Line Stencil, Inc.

Sawa Ultrasonic Stencil Cleaners

Sawa Ultrasonic Stencil Cleaners

New Equipment | Cleaning Equipment

Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe

Seika Machinery, Inc.

RO400FC Full Convection Reflow Oven

RO400FC Full Convection Reflow Oven

New Equipment | Reflow

Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400

ESSEMTEC AG

“Hybrid” High Reliability Low Ag Solder Paste

New Equipment | Solder Materials

Tokyo, Japan – Koki Company Limited, global manufacturer and supplier of soldering materials, announces the release of new low Ag containing halogen free solder pastes that secures the equivalent joint reliability and heat profile to SAC305, namely S

Koki Company LTD

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech


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