Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
1. High precision quantification supplier liquid system.. Dispensing tolerance accuracy is 0.0001ml 2. CCD image magnification listing, "+"target precision piston programming can ensure that Dispensing positional accuracy. 3. Japan imports se
High speed, precision dispensing by digital and cam drives. High speed, precision dispensing: 0.08 sec./dot saves floor space due to compact design. Glue is charged with compressed air at a high speed and the advanced cam-link head mechanism is abl
High-speed, High-accuracy and Stable Dispensing for High-density Mounting The YSD comes to market as the successor to Yamaha’s “YGD” dispenser model that won a reputation for answering market needs for compactness and low cost while achieving the i
Full Vision, Multi-Function and High Speed Chip Mounter, Compact Glue Dispenser, Optical Inspection Machine, X-Ray Inspection Machine, Screen Printer, Reflow Oven, Loader & Unloader and others.
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
Techcon Systems offers a wide range of fluid dispensing valves from simple manual dispensing to precision valves for high speed automated applications. These valves are state-of-the-art products designed for spraying conformal coatings, gasketing, s
