New SMT Equipment: holes (Page 3 of 36)

Through hole Assembly

Through hole Assembly

New Equipment | Assembly Services

Mixed Technology & Through-Hole PCB Assembly : We have full capability for assembling both Through-Hole and mixed technology PCB assemblies and can also offer a number of peripheral services such as conformal coating and potting etc. In addition, we

Prosoyo Technology Limited

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

Multilayer PCB

Multilayer PCB

New Equipment | Inspection

Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width

Multycircuit Technology Limited

SMT and Thru Hole PCB Assembly

New Equipment |  

We work as an integrated extension of your manufacturing department in assembling surface mount and thru hole assemblies. On consignment basis or turn key, we will do our best to meet our manufacturing deadlines and ship JIT (Just In Time). When Qu

MICRON CORP.

JUKI JM Series Hybrid Through-Hole Placement and Conventional SMT

JUKI JM Series Hybrid Through-Hole Placement and Conventional SMT

New Equipment | Pick & Place

JUKI’s revolutionary technology adds through-hole placement along with conventional SMT. Multi-Task Platform Achieve higher quality and labor savings by automating manual insertion. The JM100 / JM20 automates the manual insertion and clinch

Juki Automation Systems

Through-Hole Equipment

New Equipment |  

VCD (All Makes) Dip Inserters Sip Inserters Wavesolder systems (Single & Dual) Radial Inserters

ATEX International Corporation

Thru-hole Test Points

Thru-hole Test Points

New Equipment |  

Colored loops and metal turret types in a wide variety of sizes serve as attachment points for probes.

E-Mark, Inc.

Through Hole Capabilities

New Equipment |  

Universal Axial, DIP and Radial Inserters. Electrovert Econopak Wave Solder.

Advanced Electronic Assembly, Inc


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