Minimum line width/distance: 4mil; Minimum aperture: 0.25mm; Technique: Immerged Ni/Au+Entek; Layers and thickness: 7/L, blind hole board
New Equipment | Assembly Services
Mixed Technology & Through-Hole PCB Assembly : We have full capability for assembling both Through-Hole and mixed technology PCB assemblies and can also offer a number of peripheral services such as conformal coating and potting etc. In addition, we
Surface mount and through hole assembly, all types of processes
We manufacture and export Brass Neutral Links 12 Holes from High-Grade Free Cutting Brass, Brass - BS 2872 CZ 112, Brass CDA-360 or any special composition material. They are available with various features such as Not Exposed to Atmosphere, High Pol
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
